Nano Thin Film Deposition Preparation PVD Coater System With Double Chamber

Sales Manager: Gia

Email: Gia@tmaxlaboratory.com

Wechat: Dingqiuna

Item No.:
TMAX-PC-JS12
Payment:
L/C, T/T, Western Union, Credit Cards, Paypal
Shipping port:
Xiamen Port
Lead Time:
5 Days
Certificate:
CE, IOS, ROHS, SGS, UL Certificate
Warranty:
Two years limited warranty with lifetime technical support

Product Details

Nano Thin Film Deposition Preparation PVD Coater System With Double Chamber

Model: TMAX-PC-JS12-With Ion Source Cleaning & Assisted Sputtering

General Information

Category	Description
Application	Preparation of nanoscale monolayer/multilayer functional films (hard coatings, metallic/semiconductor/dielectric films). Suitable for research labs, universities, and small-batch production.
Key Features	• Anode-layer ion source (cleaning + assisted deposition) • Reverse sputtering for adhesion enhancement • Automated PC-controlled process
System Structure	Sputtering chamber, 3 magnetron targets, heating stage, DC/RF power supplies, gas/pumping systems, vacuum measurement, control unit.

Technical Parameters

Parameter	Specification
Chamber Design	Vertical front-loading, stainless steel construction
Base Vacuum	≤5×10^－5 Pa (sputtering chamber)
Pumping Speed	Recovers to 5×10^－4 Pa in 100 min (via bypass valve + turbopump)
Leak Rate	≤5×10^－7 Pa·L/s
Pressure Rise Rate	≤10 Pa after 12 hours (power off)
Pumping System	Domestic turbomolecular pump + mechanical pump
Targets	3 × 3-inch HV targets (2 standard, 1 strong magnetic field)
Power Supplies	• RF: 600 W, 13.56 MHz (auto-matching) • DC: 2 × 1000 W
Target-to-Sample Distance	40–120 mm (adjustable)
Substrate Heating	Max 450°C, programmable (rate/dwell time controllable)
Film Thickness Uniformity	±5% (e.g., Cu/Al: 4–5 μm; Ni/PTFE: 1–2 μm over 2-inch area)
Adhesion Strength	Survives 3 tape-peeling tests (glass/Si/ceramic)
Pre-Cleaning	Reverse sputtering + anode-layer ion source
Gas Control	2 MFCs (Ar + reactive gases), MKS-brand, mixing enabled
Baking	IR heating, max 150°C
Safety	Water/power failure interlocks, anti-misoperation protection
Automation	PC-controlled (target switching, substrate rotation, temperature)

Performance Advantages & Suitability

Feature	Benefit	Target Applications
Ion Source + Sputtering	Ensures clean surfaces and high adhesion	Semiconductor films, optical coatings
Multi-Mode Deposition	Supports DC/RF, reactive sputtering, multilayers	Research on novel functional materials
Precise Automation	Reduces human error, improves reproducibility	Small-batch prototyping, academic labs
Rapid Pumping	Minimizes downtime between runs	High-throughput R&D environments

Key Features & Suitability

· High-Precision Deposition: Ensures uniform, high-adhesion films for research and prototyping.

· Multi-Functional Cleaning: Combines ion source + reverse sputtering for optimal surface preparation.

· Flexible Configuration: Supports DC/RF modes, multilayer films, and reactive sputtering.

· User-Friendly Automation: PC-controlled workflow reduces manual errors.

Ideal for: Advanced material research, semiconductor labs, and functional coating development requiring reproducible, high-quality thin films.

Thin Film Deposition