High Precision Vision Guided Picosecond UV Laser Scribing System for Thin Film Solar Cell Manufacturing

Sales Manager: Gia
Email: Gia@tmaxlaboratory.com
Wechat: Dingqiuna

Item No.:
TMAX-KT-PMUV8
Certificate:
CE Certified
Warranty:
1 Year limited warranty with lifetime support

Product Details

High Precision Vision Guided Picosecond UV Laser Scribing System for Thin Film Solar Cell Manufacturing

1. Product Application: Laser Precise Micro-Processing

This equipment is equipped with a picosecond ultraviolet laser and a high-precision CCD vision system. Combined with high-performance peripheral configurations, it is mainly used for processing thin film materials. This equipment is mainly applied to laser marking of thin film batteries, especially excelling in the preparation of perovskite battery modules, and can achieve high-precision processing of the four processes P1-P4.
2. Specification Overview

2.1 Equipment Name and Model

High Precision Visual Positioning Laser Marking Device: KT-PMUV8

2.2 Equipment Parameters

Equipment Name	High-precision visual laser marking device
Equipment model	KT-PMUV8	Workstation number: Single workstation
Equipment dimensions	1500mm* 950mm*1950mm
Types of lasers	Semiconductor pumped laser (355nm)
Laser (customizable)	8W @500KHZ；		Pulse width < 20 ps
	Pulse stability: less than 2% RMS over 10 minutes		Output light spot: (3) ±0.2 mm
	M²:＜1.2		Cooling method: Closed-loop water cooling system
Musculoskeletal System:
X-axis	Processing size: 150mm		Resolution: 0.1 um
	Maximum movement speed: 300mm/s		Acceleration: 0.5g
	Acceleration and deceleration time: 0.1s		Acceleration and deceleration distance: approximately 13mm
	Positioning accuracy: ±20um		Repeatability positioning accuracy: ±10 um
Y-axis	Processing size: 150mm		Resolution: 0.1 micrometer
	Maximum movement speed: 300mm/s		Acceleration: 0.5g
	Acceleration and deceleration time: 0.12s		Acceleration and deceleration distance: approximately 10mm
	Positioning accuracy: ±20um		Repeatability positioning accuracy: ±10um
Z -axis	Travel: 200mm		Resolution: 0.10um
	Maximum movement speed: 20mm/s
	Positioning accuracy: ±25 um		Repeatability positioning accuracy: ±10 um
Motion controller	Ethercat scan cycle ≤ 1ms
Workstation style	Manual clamping fixture		Loading and unloading method: Manual
Dust-proof	1-layer dustproof design
Positioning system: Visual positioning

Alignment method	Paraxial positioning
Aligned shot	Optical magnification: 0.5 times		Pixel: 1200W
Focus lens	Optical magnification: 6 times		Pixel: 1200W
	Camera spectrum: Black and white		Pixel size: 3.45um x 3.45um
Light source	Structure: Point light source		Wavelength: Red light; Power: 3W
Processing system
Focus mode Power measurement	Image (automatic/semi-automatic) focusing
	Focusing range: 0.1mm Focusing accuracy: ±15 μm
Mirror prism	15W power meter probe (optional)
Repetition scanning accuracy	SCANLAB	Field lens: F210
Focus mode	±15um
Maximum scanning area	150mm*150mm（F210）
Maximum scanning speed	10000mm/s (Linear)
Focus spot size	25um（1/e² )
Blowing method	No blowing air
Dust prevention	Smoke-free purifier		Air volume:
Processing software:
Software environment	Windows 10 operating system		Software version: Simplified Chinese
Software version number
Software permission classification	Level 3: Super administrative privileges; Engineering staff privileges; Operator privileges
Software parameter file	Storage, import, export; provide multi-dimensional motion parameters, laser parameter control;
Software log display	Perform real-time monitoring of the laser, platform and all I/O ports; display error messages in case of failure;
Drawing import format	Directly import, store or export CAD software files in formats such as DXF and DWG;
Graphic online editing	Editing of straight lines, curves, arcs, polygons and simple irregular shapes;
Graphic error correction	Providing alarm prompts for abnormal shapes
Automatic marking point capture	Offering mark point graphic learning, supporting four target point positioning;
Semi-automatic focusing	Provide semi-automatic image focusing function;
Image correction	Provide semi-automatic image correction function;
Graphic measurement	In conjunction with the imaging system, the software can perform simple size measurement on the processed workpieces;
Other customized functions	Customized development can be provided according to the characteristics of the product processing technology.

2.3 Factory Requirements

l Suggested factory layout:

l Factory Layout:

Power supply	Single-phase 220VAC, 50Hz, 20A
Compressed air	0.4 - 0.8 Mpa, quick connector, 10mm air pipe, gas consumption 3m3/h
Environmental temperature	Temperature 18 - 26℃, temperature variation within ±1℃/24HR, no strong convective air
Environmental humidity	It should be maintained within the range of 35% to 65%.
Cleanliness requirements	Class 106 or better would be preferable.
Load-bearing requirements for the base plate	More than 850kg/㎡
Equipment weight	About 1.6t
Total equipment power consumption	2.7KW

2.4 Equipment Maintenance Cycle

Component	Suggested maintenance period	Maintenance Contents	Method
Laser	6 months	Power Optimization	Remote maintenance
Optical path	3 months	Lens Cleaning, Optical Path Adjustment	Technician maintenance
Exercise platform	3 months	Adding Lubricating Grease	Technician maintenance
Caravan	6 months	Flatness	Image focusing
Water-cooled machine	2 months	Replace distilled water	Self-replacement
Dust collection fan	12 months	Replace filter element	Self-replacement
Other	/	/	/