Glovebox R&D Lab Magnetron Sputtering Coater For Thin Film Deposition

Model: TMAX-PC-JS02-D-Shaped Magnetron Sputtering Coater

Main Purpose

Designed for the preparation of nano-scale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor films, dielectric films, and other advanced thin-film materials. Widely used in universities, research institutes, and small-batch production in scientific laboratories.

System Composition

· Vacuum chamber system (sputtering chamber)

· Target system

· Sample stage system

· Vacuum pumping & measurement system

· Gas flow system

· Control system

· Film thickness monitoring system

· Front-opening door mechanism

· Electrical control system

Technical Specifications

Parameter	Specification
Ultimate Vacuum	6.7×10-5 Pa
System Leak Rate	1×10-7 Pa·L/s
Vacuum Recovery Time	40 min to 6.6×10 Pa (after N2 purge)
Vacuum Chamber	D-shaped, 400 × 350 × 300 mm
Sample Stage	3" × 3", 3.2 mm thickness
Magnetron Targets	3 targets (2 standard + 1 high-strength)
Effective Sputtering Area	3" × 3"
Target Diameter	Φ50 mm (water-cooled)
Target-to-Substrate Distance	50–90 mm (adjustable)
Substrate Bias Voltage	-200 V
Sample Turntable	1 position (holds 2" substrates)
Gas Flow System	2-channel mass flow controller
Film Thickness Monitor	0–999,999 Å
Pumping Options	Turbo molecular pump or cryogenic pump + dry scroll pump

Key Features & Applications

1. High Precision & Versatility

· Suitable for research and small-scale production of high-performance thin films, including optical, electronic, and protective coatings.

· Adjustable target-substrate distance ensures optimized film uniformity.

2. Advanced Control & Monitoring

· Computerized real-time tracking of deposition parameters enhances repeatability.

· Flexible gas flow control (2-channel MFC) supports reactive and non-reactive sputtering.

3. Efficient & Reliable Vacuum System

· Fast vacuum recovery minimizes downtime.

· Dual pumping options (turbo or cryogenic) adapt to different process requirements.

4. User-Friendly Design

· D-shaped chamber & front-opening door facilitate easy sample loading.

· Optional heating expands compatibility with temperature-sensitive materials.

Ideal for:

· Academic & industrial R&D in materials science, nanotechnology, and semiconductor engineering.

· Functional film development for optics, wear resistance, and electronic devices.

· Prototype fabrication requiring high-precision, customizable coatings.

This system combines high deposition control, flexible configuration, and robust performance, making it a preferred choice for advanced thin-film research and development.

1 Standard exported package: Internal anticollision protection, external export wooden box packaging.

2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.

3 Responsible for the damage during the shipping process, will change the damage part for you for free.