Glovebox 4-Target Multi-Mode Metal PVD Sputtering Deposition System For R&D

Model: TMAX-PC-JS05-Target Multi-Mode Sputtering (DC + RF + Strong Magnetic Field)

Technical Parameters

Category	Specification
Chamber Structure	Horizontal design, electric lift-off top cover, stainless steel/vacuum materials
Base Vacuum	≤5×10⁻⁵ Pa
Working Vacuum	≤5×10⁻⁴ Pa (achieved in 100 min after pump-down)
Leak Rate	≤5×10⁻⁷ Pa·L/s
Pressure Rise Rate	≤10 Pa (after 12 h shutdown)
Pumping System	Domestic molecular pump + mechanical pump
Target Configuration	4 × 6-inch targets (3 standard-field, 1 strong-field); DC/RF, max 5,000 W
Target-Substrate Distance	40–120 mm (adjustable)
Substrate Heating	Max 400°C, programmable rate/dwell time
Film Thickness Uniformity	≤5% (2-inch area; Cu/Al: 4–5 µm; Ni/PTFE: 1–2 µm)
Adhesion Standard	Passes 3× tape peel tests (glass/Si/ceramic substrates)
Pre-Cleaning	Reverse sputtering capability
Ion Source	Anode-layer ion source (cleaning + assisted deposition)
Gas Control	2 MKS mass flow controllers (reactive/Ar gases), mixing/pressure adjustment
Baking Temperature	150°C (infrared heating)
Safety Protections	Water/power failure interlock, anti-misoperation design
Automation	PC-controlled (target switching, rotation, temperature, shutters)

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Key Features & Suitability Analysis

1. Precision Deposition for Advanced Films

· Nanoscale control: Achieves ≤5% thickness uniformity for functional films (e.g., semiconductors, hard coatings).

· Multi-material flexibility: Simultaneously supports metals (Cu/Al), dielectrics (PTFE), and compounds via 4 targets.

2. Enhanced Process Stability

· Ion-assisted deposition improves film adhesion and density.

· Pre-sputtering cleaning ensures contamination-free substrates.

3. User-Friendly Operation

· Automated PC control simplifies complex processes (e.g., multilayer deposition).

· Horizontal chamber design enables quick sample loading.

4. Industrial & Research Versatility

· R&D labs: Ideal for prototyping optical, electronic, or wear-resistant coatings.

· Small-batch production: Reliable for precision coatings in aerospace or semiconductor sectors.

5. Safety & Maintenance

· Liner plates protect chamber walls, reducing maintenance downtime.

· Interlocks prevent damage from operational errors.

Summary: This excels in high-repeatability, multi-material deposition, and automation, catering to both cutting-edge research and specialized industrial coating needs.

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Why Choose?

1. 4-Target Multi-Mode Sputtering (DC + RF + Strong Magnetic Field)

· Unique Feature: Only system in its class offering 3 standard-field targets + 1 strong-field target in a compact design.

· Competitor Comparison: Most systems provide only DC or RF targets separately, limiting material compatibility.

· Client Benefit: Enables simultaneous deposition of metals, insulators, and alloys (e.g., Cu+Al₂O₃+Ni) without breaking vacuum.

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2. Ultra-High Vacuum with Rapid Recovery (<100 min to 5×10⁻⁴ Pa)

· Unique Feature: Patented bypass pumping + dry nitrogen venting reduces pump-down time by 40% vs. industry average.

· Competitor Comparison: Comparable systems often require 3+ hours to reach working vacuum after venting.

· Client Benefit: Dramatically improves throughput for batch processing (e.g., 8–10 runs/day vs. 4–5 with competitors).

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3. Integrated Ion-Assisted Deposition (IAD) for Superior Film Quality

· Unique Feature: Built-in anode-layer ion source for in-situ cleaning + energy-enhanced deposition.

· Competitor Comparison: Most systems require external ion guns (added cost/complexity).

· Client Benefit: Achieves >2x better adhesion (passes 10+ tape tests vs. industry-standard 3) and denser films for optical/barrier coatings.

1 Standard exported package: Internal anticollision protection, external export wooden box packaging.

2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.

3 Responsible for the damage during the shipping process, will change the damage part for you for free.